Reliable Detection of Any Defect
2D and 3D simultaneous imaging
Accurate measurement of solder paste shape
| Cross-section area | Cross-section area at rising section of solder paste | 3D |
| Protrusion area | Presence and size of print horn | 3D |
| Volume | Amount of solder paste | 3D |
| Average height | Amount of solder paste / cross-section area | 3D |
| Printing deviation | Printing gravity center | 3D |
| Bottom area | Determining soldering condition | 2D |
| Bridging | Determining bridging (including prior detection) | 2D |
2D images provide the reliability as records similar to photos.
Detects defects that may occur below the 3D reference plane by implementing 2D inspection simultaneously
Stably detects any printing defects
- Detects any bridging defect below the 3D reference plane
- Detects “potential” bridging
- Detects spilled solder
Foreign substance inspection
2D inspection uses illuminance information and 3D inspection uses height information to detect foreign substance.
