NVI-S300
VISUAL INSPECTOR NVI-S300
3D Solder Paste Inspection System
High-accuracy 3D SPI that can control changes
Main specifications
| PCB size | 50x50mm – 510ｘ460ｍｍ |
| PCB thickness | 0.3 – 4.0mm |
| Transfer reference | Factory set to Rear or Front |
| Convey direction | Factory set to Left to right or Right to left |
| Transfer height | 900±25ｍｍ |
| Camera resolution | Factory set to 18 µm or 12 µm |
| Illumination | 2D: Whole circumference upper/lower stages RGB / 3D: Laser optical cutting |
| Inspection data creation | Automatically converted from Gerber data |
| Power supply | 100 VAC ±10%, 1.5kVA, Single phase (50/60Hz) |
| Dry air | 0.4 – 0.5Mpa 10Nl/min |
| External dimensions | W1,100mm x D1,200mm x H1,550mm (excluding signal tower) |
| Weight | Approx. 400 kg |
| Options | Support for L=750 mm (by dividing into two areas) Support for 1D/2D codes Statistical analysis software Offline software |