NXI-3510 / NXI-3500IM




Next-generation X-ray Automated Inspection System

NXI-3510 covers 3D CT, oblique and 2D inspection. NXI-3510 supports C4 bump, LTH and BGA/CSP auto inspection. Also supports large size work loading up to 510mm x 370mm. NXI-3500IM is perfectly suitable for BGA/CSP and power device auto inspection. Provides superior quality assurance level even in fewer void environment.

Throughput Highly Enhanced

  • CT capturing time reduced to less than 1/3 comparing with our conventional model NLX-5000
  • Inspection speed highly enhanced by high-speed FPD & newly developed machinery technology
  • Image capturing time requires only <8 sec/FOV at 16 projections

*Amount of projection & resolution may change depending on the state of inspection target

Imaging Quality Further Improved

  • Machine accuracy highly improved by high stiffness frame and liner scale
  • Proprietary image processing technology & high-sensitive FPD provides clear image
  • These unique features work to obtain high-quality CT image and to improve automated inspection precision

Full Coverage Capturing Mechanism – Vertical, Oblique and CT

  • Captures at any angles from 0 to 60 degrees, providing best capturing condition
  • Single detector covers vertical angle, oblique angle and CT capturing, achieving high cost performance
  • Max. 0.33 μm high resolution capturing available

*Resolution changes depending on the angle at oblique and CT capturing


Inspection Specifications

Inspectable board sizeDimensions : Max. W510 x L370mm
Thickness : Max. 3mm Weight : Max. 2kg
Board top / bottom clearanceTop : 50mm,Bottom : 1.5mm
Inspection item2D : Component inspection and solder bump inspection using transmission image
3D : Solder bump (BGA & C4) inspection and planting-filled TH inspection using CT image

System Specifications

X-ray sourceOpen tube micro focus,Tube voltage : 20-160kV,Tube current : 0-200μA,Max. resolution : 1μm
DetectorSensor Type : 3M pixels
Oblique capturing angle0-60°
Geometric magnificationMax. 900 times
Image magnification ratioVertical capturing : Max. x225
60° oblique angle capturing : Max. x112
Image resolutionVertical capturing : Max. 0.33μm
60° oblique angle capturing : Max. 0.67μm
X-ray leakage dose0.5μSV/h or less
Outside dimensionsW1,680mm × D1,900mm × H1,940mm
Power supplyThree-phase AC 200-240V, 3kVA

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