Automated Optical Inspection System

Standard Desktop Solder Joint Inspection System

Main specifications

Board sizeL50 x W50mm – L330xW250mm
Board thickness0.4 – 3.0mm
Board weightMax. 2.0Kg
Board clearanceTop: 30mm / Bottom: 60mm *1
Board clamping edgeFront: 3.0mm / Rear: 3.0mm
Non-inspectable areaFront: 5.0mm / Rear: 5.0mm
Component packagePAD, CHIP, SOT, SMC, SOP, QFP, SOJ, PLCC, IMD
Inspection coverageSoldering quality: open, non-wetting, bridging
SMD: part skew, missing, polarity, wrong direction, rotation, lead skew
IMD: cold solder, no lead, non-wetting, blow hole
Special inspection: OCR, contamination (solder ball)
Power voltageSingle phase AC200 – 240V
50 / 60Hz
Power consumption1.0kVA or less
Environmental req.10 – 35℃ 35 – 80%RH (non-condensing)
FootprintW600 x D920 x H650mm *2
WeightApprox. 100kg

*1 Including board warpage. Top: 20mm / Bottom: 60mm applied when two-color lighting (non-compatible to NVI-FXHIII) model selectd.

*2 Excluding handle, monitor and signal tower.

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