X-RAY INSPECTOR NXI-3310
High-speed & Precise Automatic Inspection for Various Components
NXI-3310 is the inline high-speed 3D X-ray inspection system. The automated inspection function is designed to inspect various type of on-board devices at one time, covering leaded components, chip components and area array devices such as BGAs and CSPs.
Inspection Algorithm for Various Types of Component
- Lead and chip components as well as BGA and SCP can be automatically inspected.
- Solder inspection items corresponding to each component are available.
High Speed Automated Inspection
- Requires only approx.75 sec to inspect entire double-sided PCB (330 x 250 mm).
- Sophisticated sensor, internal shutter and rigid gantry structure ensure stable inspection quality.
- Ideal for the trial production and evaluation.