High-speed & Precise Automatic Inspection for Various Components

NXI-3310 is the inline high-speed 3D X-ray inspection system. The automated inspection function is designed to inspect various type of on-board devices at one time, covering leaded components, chip components and area array devices such as BGAs and CSPs.

Inspection Algorithm for Various Types of Component

  • Lead and chip components as well as BGA and SCP can be automatically inspected.
  • Solder inspection items corresponding to each component are available.

High Speed Automated Inspection

  • Requires only approx.75 sec to inspect entire double-sided PCB (330 x 250 mm).
  • Sophisticated sensor, internal shutter and rigid gantry structure ensure stable inspection quality.

Analysis Function

  • Ideal for the trial production and evaluation.

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Related page:X線検査装置(AXI)

NXI-3510 / NXI-3500IM