3D Solder Paste Inspection System

High-accuracy 3D SPI that can control changes

Main specifications

PCB size50x50mm – 510x460mm
PCB thickness0.3 – 4.0mm
Transfer referenceFactory set to Rear or Front
Convey directionFactory set to Left to right or Right to left
Transfer height900±25mm
Camera resolutionFactory set to 18 µm or 12 µm
Illumination2D: Whole circumference upper/lower stages RGB / 3D: Laser optical cutting
Inspection data creationAutomatically converted from Gerber data
Power supply100 VAC ±10%, 1.5kVA, Single phase (50/60Hz)
Dry air0.4 – 0.5Mpa 10Nl/min
External dimensionsW1,100mm x D1,200mm x H1,550mm (excluding signal tower)
WeightApprox. 400 kg
OptionsSupport for L=750 mm (by dividing into two areas)
Support for 1D/2D codes
Statistical analysis software
Offline software

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